Analysis of a Thermoelectric Cooler With Non-Uniform Heating

Autor:	R. E. Simons, M. J. Ellsworth
Rok vydání:	2000
Předmět:	Condensed Matter::Materials Science Thermoelectric cooling Materials science Condensed Matter::Superconductivity Condensed Matter::Strongly Correlated Electrons Mechanics Algebra over a field Thermal conduction Finite element method
Zdroj:	Packaging of Electronic and Photonic Devices.
DOI:	10.1115/imece2000-2273
Popis:	This paper discusses a methodology for incorporating the behavior of a thermoelectric cooling module in a finite element model of an electronic chip module. A background discussion of thermoelectric cooling is provided followed by a discussion of algebraic solutions for either chip temperature or allowable power on a uniformly powered multi-chip module. The basis and method of implementing an integrated thermoelectric-conduction model in ANSYS is presented. Example calculations are presented and discussed for a thermoelectrically cooled non-uniformly powered MCM. A “quasi-superposition” approach combining results obtained by 1-D algebraic solutions with thermoelectric cooling, with ANSYS results without thermoelectric cooling is also discussed. This approach offers a means to estimate the chip temperatures on an MCM cooled by a thermoelectric module without the need to actually build a detailed and time consuming finite element model of the thermoelectric module.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7570a2990984aa52af48505dbe7627a3 https://doi.org/10.1115/imece2000-2273 Zobrazit plný text záznamu