Tin Sensitization for Electroless Plating Review
| Autor: | Xingfei Wei, D. K. Roper |
|---|---|
| Rok vydání: | 2014 |
| Předmět: |
chemistry.chemical_classification
Materials science Fabrication Renewable Energy Sustainability and the Environment chemistry.chemical_element Nanotechnology Polymer Condensed Matter Physics Copper Silsesquioxane Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry.chemical_compound chemistry Materials Chemistry Electrochemistry Galvanic cell Polystyrene Tin Palladium |
| Zdroj: | Journal of The Electrochemical Society. 161:D235-D242 |
| ISSN: | 1945-7111 0013-4651 |
| DOI: | 10.1149/2.047405jes |
| Popis: | Recent interest in tin sensitization is growing due to its economic and tunable capacity for precise, controllable nanoscale metallization of surfaces on various substrates used in microcircuits, electronics, solar cells, and catalysts. Zabetakis and Dressick recently discussed selective electroless metallization of patterned polymer films for fabrication of electrical interconnects, plasma-etch-resistant masks, and diffusion barriers in electronics. 1 Refining the tin sensitization solutions allowed fabrication of ∼50 nm width features in metal for industrial use and enabled fabrication of sub 10 nm metal features. John et al. used stannous chloride (SnCl2) as both reducing and stabilizingagenttosynthesizeplatinum(Pt)catalyticclusterswithlessthan 20 atoms. 2 Tin/silver (Sn/Ag) catalyst has been used as an economic replacementfortin/palladium(Sn/Pd)catalystinelectrolessplatingof silver and copper on epoxy-based polyhedral oligomeric silsesquioxane (POSS) films. 3 Sensitization using SnCl2-HCl and activation with Pt colloid solution have been employed to coat tunable shell thickness (35‐198 nm) of Ag film on polystyrene (PS) microspheres. 4 Sensors to measure solution dielectric constant were made via tin sensitization with trifluoroacetic acid (TFA), ammoniacal silver nitrate activation, and galvanic gold (Au) replacement on sodium. 5 Notwithstandingthisgrowinginterestintinsensitizationinelectrolessplating, its mechanism and relevant methodological characteristics have not been systemically reviewed. This work reviews development of the electroless plating approachesandexaminescriticalfeaturesofcommonmethods.Physicochemical characteristics of tin sensitized substrates, optimal treatment of surfaces prior to electroless plating, and proposed mechanisms of electroless plating are evaluated. Conventional two-step sensitization is compared with a single-step catalyzing system. The review concludes with an overview of optimized methods, their current application, and future prospects in the field. |
| Databáze: | OpenAIRE |
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