A 4×12.5 Gb/s CWDM Si photonics link using integrated hybrid silicon lasers

Autor:	John Heck, Brian R. Koch, Haisheng Rong, Robert Beatty, Tao Yin, Neal Na, Lior Horwitz, Roi Bar, Ansheng Liu, Mike Morse, Andrew Alduino, Dror Lazar, Ling Liao, Kevin Sullivan, Brian H. Kim, Hai-Feng Liu, Christine Krause, Richard Jones, Frederic Haubensack, Rushdy Saba, Mathew N. Sysak, Olufemi I. Dosunmu, Wei-Zen Lo, Juthika Basak, I-Wei Hsieh, Jock Bovington, Mario J. Paniccia, Stas Litski
Rok vydání:	2011
Předmět:	Silicon photonics Materials science Packaging engineering Silicon business.industry Photonic integrated circuit Electronic packaging chemistry.chemical_element chemistry Silicon Photonics Link Wavelength-division multiplexing Optoelectronics Photonics business
Zdroj:	CLEO:2011 - Laser Applications to Photonic Applications.
DOI:	10.1364/cleo_si.2011.cthp5
Popis:	We demonstrate a 4λx12.5Gbps Silicon Photonics CWDM link integrating all optical components, electronics, and packaging technologies required to form the link.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::749e1e22321cb5de63f9fcddf53a9a2e https://doi.org/10.1364/cleo_si.2011.cthp5 Zobrazit plný text záznamu