Can nanoindentation help to determine the local mechanical properties of microelectronic materials? a state-of-the-art review

Autor:	T. Hannach, Wolfgang H. Müller, K. Muller, H.-J. Albrecht, A. Juritza, A. Hase
Rok vydání:	2005
Předmět:	Reflow soldering Materials science business.industry Soldering Reference values Indentation Metallurgy Intermetallic Microelectronics State of the art review Composite material Nanoindentation business
Zdroj:	Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Popis:	We investigate the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Moreover, we shall try to answer the question as to whether nanoindentation can be used to quantify the growth of intermetallic phases, at least at the interface of a solder connection. Different specimens and treatments (such as reflow processes and subsequent aging) have been analyzed. The results of these experiments serve as reference values for FE-simulations which are also discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7498f8255dbed216ca2d8f0ce7dda52c https://doi.org/10.1109/eptc.2004.1396652 Zobrazit plný text záznamu