A Novel Method of CoW Bonding for High Density Ultra-Fine Pitch IC Stacking Application

Autor:	Ling Xie, Daniel Ismael Cereno, Yong Liang Ye, Sunil Wickramanayaka, Jerry Aw Jie Li
Rok vydání:	2016
Předmět:	Materials science Artificial Intelligence Control and Systems Engineering business.industry Mechanical Engineering Stacking Optoelectronics High density Ultra fine business
Zdroj:	International Journal of Mechanical Engineering and Robotics Research.
ISSN:	2278-0149
DOI:	10.18178/ijmerr.5.4.276-279
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::748feb89837eb423def0693c7a6e6fcc https://doi.org/10.18178/ijmerr.5.4.276-279 Zobrazit plný text záznamu