3D Stacking Process with Thermo-Sonic Bonding Using Non-conductive Film

Autor:	Takatoshi Ishikawa, Naoki Kanagawa, Teppei Kojio, Kazuki Watanabe, Yamatsu Shigeru
Rok vydání:	2018
Předmět:	Viscosity Materials science Silicon chemistry Through-silicon via Delamination Thermal Stacking chemistry.chemical_element Composite material Electrical conductor Throughput (business)
Zdroj:	2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc.2018.00307
Popis:	In this research, a combination of thermo-sonic bonding (TSB) process and non-conductive film (NCF) material was used to fabricate vertically stacked through silicon via (TSV) assemblies. TSB is particularly attractive TSV assembly process because it offers up to 10x throughput improvement when compared to conventional processes. By adjusting the properties (e.g. viscosity, and reaction time) of NCF, a 4-layer stacked assembly was fabricated without voids or delamination. Moreover, these parts exhibited no failures after 2,000 times thermal cycles test (-40oC to 125oC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::747b31c2b1cd01c60f4c866e9a9c7dfd https://doi.org/10.1109/ectc.2018.00307 Zobrazit plný text záznamu