Autor: |
Liangliang Liu, Xiongbo Zhao, Jiang Penglong |
Rok vydání: |
2014 |
Předmět: |
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Zdroj: |
2014 15th International Conference on Electronic Packaging Technology. |
DOI: |
10.1109/icept.2014.6922838 |
Popis: |
A SiP(System in Package) consists of multiple chips stacked and connected within a package. And SiP testing is a significant and growing problem owing to the limited accessibility and its particular test flow. It requires individual chip-level, interconnections test, post-packaging test and final system testing. This paper presents an overview of SiP test flow and the problem encountered by SiP test, and suggests its solution — the IEEE 1500 Standard for Embedded Core Test (SECT). IEEE 1500 provides test access structure and mechanisms to implement the parallel scheduling test for hierarchical SiP. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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