Single TO-can GPON ONU bi-directional optical sub-assembly with Si-Micromechanics
| Autor: | Leos Halmo, Mao-Chieh Hsu, Joerg-R. Kropp |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Distributed feedback laser
Optical fiber Materials science business.industry 020208 electrical & electronic engineering Optical power 02 engineering and technology Passive optical network law.invention Photodiode Lens (optics) Responsivity law Wavelength-division multiplexing 0202 electrical engineering electronic engineering information engineering Optoelectronics business |
| Zdroj: | 2017 IEEE CPMT Symposium Japan (ICSJ). |
| Popis: | We present a new bidirectional optical subassembly (BOSA) packaging method which utilizes silicon optics and mechanics to integrate a lens, a DFB laser, a monitor photodiode (MPD) and a wavelength division multiplexing (WDM) filter into a silicon submount. The technology enables a compact packaging form within in a single trasnsistor outline can (TO-can) for BOSA. We made most of the assembly process on a designed silicon submount wafer. The wafer scale assembly brings the advantages for handling, burn-in screening and testing in high-volume production. Our results show promising optoelectronic performance for the GPON class B+ optical network unit (ONU). The output optical power is typically above 2mW and the average responsivity above 0.8A/W with the sensitivity above −29dbm is demonstrated. The demonstrated technique provides an alternative way to fabricate of a low-cost and compact size BOSA for various potential applications. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|