Near-Infrared Microscopy in Semiconductor Failure Analysis Applications

Autor: Robert Reagan, Tom Jiang, Thomas B. Davis, Yangyang Sun
Rok vydání: 2009
Předmět:
Zdroj: International Symposium for Testing and Failure Analysis.
ISSN: 0890-1740
DOI: 10.31399/asm.cp.istfa2009p0135
Popis: There has been ample discussion concerning the use of near infrared microscopy (NIR) in fields such as medical, materials science, and more recently in applications aimed toward micro-electro-mechanical systems (MEMS); however, little attention has been paid to the application of NIR microscopy in the verification and failure analysis of semiconductor memory devices. This paper will present a discussion of NIR and laser scanning confocal near-infrared microscopy, sample preparation for NIR microscopy, and emphasize examples of laser scanning confocal NIR microscopy in the measurement and failure analysis of silicon samples typical to the semiconductor industry.
Databáze: OpenAIRE