Wafer-to-Wafer Hybrid Bonding Challenges for 3D IC Applications

Autor:	H. Y. Li, Hong Miao Ji, Alfred Neo Siang Kiat, Masaya Kawano
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663937
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::737ac6228636d2dd0f8c439cfcc09867 https://doi.org/10.1109/eptc53413.2021.9663937 Zobrazit plný text záznamu