Thermal analysis of multi-layer functional 3D logic stacks
| Autor: | Christian Bergeron, Michael R. Scheuermann, R. P. Robertazzi, M. Wordeman, S. Tian, Christy S. Tyberg, Joel Abraham Silberman, H. Jacobson, Phillip J. Restle |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Stacking Three-dimensional integrated circuit 02 engineering and technology Heat sink 021001 nanoscience & nanotechnology 01 natural sciences Temperature measurement 0103 physical sciences Thermal Electronic engineering Layer (object-oriented design) 0210 nano-technology Thermal analysis Multi layer |
| Zdroj: | 3DIC |
| Popis: | 3D chip stacking technology has the potential to enable increased system performance through integration of heterogeneous system components, such as accelerators and high density memory, as well as through increased area for tightly integrated processor components in multi-core systems. This paper describes the design, measurements and a thermal modeling methodology used to achieve accurate 3D thermal model-to-hardware correlation for two and three layer 3D high-power “logic” stacks. |
| Databáze: | OpenAIRE |
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