Sn Whiskers Nucleation and Growth - Short Review
| Autor: | N. Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Materials science
Whiskers 05 social sciences Metallurgy Intermetallic growth Nucleation 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Atomic and Molecular Physics and Optics Residual stress 0502 economics and business General Materials Science 0210 nano-technology 050203 business & management |
| Zdroj: | Solid State Phenomena. 280:175-180 |
| ISSN: | 1662-9779 |
| Popis: | Sn whisker growth on Cu substrate Pb-free solder is a serious problem in electric and electronic devices and as well as in aerospace applications. Due to the concern on the toxicity of lead by Restriction of Hazardous Substances Directive (RoHS), new lead free materials have been developed, and this resulted in the resurfacing of Sn whisker. The compressive stress, corrosionand surface oxide have been identified as the driving force for Sn whisker formation induced by mechanical alloying and oxidation. In this paper, we report the study to understand the mechanism of Sn whisker growth that control whisker formation on Sn finished.Based on the review, a preliminary conclusion has been made, where the analysis of the topography and microstructural characterization can be determined by evaluating under various environmental influences.Furthermore, the whisker growth happening on lead-free soldered can be considerably reduced by controlling the compressive stress in the solder which initiates the growth of intermetallic compounds (IMCs). |
| Databáze: | OpenAIRE |
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