Production maturity of 64 M/256 M furnace and RTP processes on 300 mm wafers
| Autor: | W. Kürner |
|---|---|
| Rok vydání: | 2001 |
| Předmět: |
Production line
business.industry Computer science Process capability Volume (computing) ComputerApplications_COMPUTERSINOTHERSYSTEMS Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Reliability (semiconductor) Production (economics) Wafer Electrical and Electronic Engineering Process engineering business Unit process Dram |
| Zdroj: | Microelectronic Engineering. 56:41-48 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/s0167-9317(00)00502-5 |
| Popis: | Along with the transition to 300 mm wafers, wafer suppliers, tool vendors and device manufactures are confronted with new challenges. The high quality standard of 200 mm is the baseline for recent developments on 300 mm. Wafer quality, tool reliability as well as unit process and integration issues, are the main focus of interest. The current status for the diffusion area at Semiconductor300 shall be presented in this paper. The readiness of our tool set for 300 mm volume production is shown in terms of process capability of batch furnaces and single wafer tools, manufacturing key parameters and cost of ownership comparisons to equivalent 200 mm tools and processes. The data presented are derived from an already qualified 0.24 μm 64 M DRAM pilot line production and can therefore be easily extended to high volume production lines. |
| Databáze: | OpenAIRE |
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