Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

Autor:	Jiexun Yu, Yao Zheng, Shengjuan Zhou, Qian Wang, Sishi Wu, Haihua Wu, Tiefu Li, Jian Cai
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::730eb17f51b36e23842dd386033606e1 https://doi.org/10.1109/icept56209.2022.9873338 Zobrazit plný text záznamu