Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application
Autor: | Jiexun Yu, Yao Zheng, Shengjuan Zhou, Qian Wang, Sishi Wu, Haihua Wu, Tiefu Li, Jian Cai |
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Rok vydání: | 2022 |
Zdroj: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). |
Databáze: | OpenAIRE |
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