Autor:	Lee Chiayu, Hang Zhou, Yue Wu, Weina Yong
Rok vydání:	2018
Předmět:	Materials science Resist chemistry Thin-film transistor Electrode chemistry.chemical_element Composite material Photoresist Science technology and society Layer (electronics) Copper Corrosion
Zdroj:	2018 9th Inthernational Conference on Computer Aided Design for Thin-Film Transistors (CAD-TFT).
Popis:	In this paper, an asymmetric metal electrode with MoTi/Cu/Mo structure was designed. Due to the appropriate anticorrosion behavior, the thin MoTi top layer prevented photoresist peeling off during the whole etch process, resulted a superior etch profile compare to the control group with a Mo/Cu/Mo symmetrical structure.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::72e188aefa4fe22987fab1b326661792 https://doi.org/10.1109/cad-tft.2018.8608114 Zobrazit plný text záznamu