Thermo-Mechanical Challenges in Stacked Packaging

Autor:	Bhavani P. Dewan-Sandur, Terry Dishongh, S. Pekin, Yongje Lee, Dereje Agonafer, Abhijit Kaisare, M.M. Hossain
Rok vydání:	2008
Předmět:	Fluid Flow and Transfer Processes Computer science law Mechanical Engineering Convergence (routing) Stacking Electronic engineering Integrated circuit Condensed Matter Physics Space (mathematics) Die (integrated circuit) Thermo mechanical law.invention
Zdroj:	Heat Transfer Engineering. 29:134-148
ISSN:	1521-0537 0145-7632
DOI:	10.1080/01457630701673170
Popis:	The convergence of computing and communications dictates building up rather than out. As consumers demand more functionality in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into the same package is becoming more crucial. Over the past few years, die stacking has emerged as a powerful tool for satisfying these challenging integrated circuit (IC) packaging requirements. In this paper, a review of thermo-mechanical challenges for stacked die packaging is discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::72443b9ed5f9c4eb41d0f17f71dad3ca https://doi.org/10.1080/01457630701673170 Zobrazit plný text záznamu Plný text ve formátu PDF Plný text ve formátu HTML
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