Resistance development on embedded heating layers during climatic test

Autor:	Dirk Seehase, Andrej Novikov, Mathias Nowottnick
Rok vydání:	2017
Předmět:	0209 industrial biotechnology Printed circuit board Substrate (building) 020901 industrial engineering & automation Materials science Resistance development Humidity 02 engineering and technology Composite material Temperature measurement
Zdroj:	2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
DOI:	10.23919/empc.2017.8346909
Popis:	The influence of environmental conditions on the resistance development of full-faced heating layers, embedded in the substrate material of printed circuit boards (PCB) is studied in this paper. Therefore suitable test boards are manufactured and subjected to temperature and humidity cycling inside a climate chamber, while measuring the electrical parameters. Different material types, suitable for forming the heating layers, are studied here.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::722900e49e9ecd10ff1e1397c5f676e8 https://doi.org/10.23919/empc.2017.8346909 Zobrazit plný text záznamu