Thin copper films deposited by low temperature plasma-enhanced metal organic chemical vapour deposition using copper-acetylacetonate
| Autor: | Andreas Hamerich, J. Müller, L. Lottermoser |
|---|---|
| Rok vydání: | 1993 |
| Předmět: |
Materials science
Mineralogy chemistry.chemical_element Surfaces and Interfaces General Chemistry Chemical vapor deposition Combustion chemical vapor deposition Condensed Matter Physics Copper Electrostatic spray-assisted vapour deposition Surfaces Coatings and Films Carbon film Chemical engineering chemistry Plasma-enhanced chemical vapor deposition Materials Chemistry Deposition (phase transition) Thin film |
| Zdroj: | Surface and Coatings Technology. 59:212-216 |
| ISSN: | 0257-8972 |
| Popis: | Plasma-enhanced metal organic chemical vapour deposition of thin copper films at low substrate temperatures using copper-acetylacetonate is investigated for deposition on temperature-sensitive substrates. Films with electrical resistivity near bulk values, a smooth surface and good adhesion quality were deposited at substrate temperatures down to 80°C. Control of the film quality by optical emission spectroscopy of the process plasma was investigated. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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