Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates
| Autor: | Kamil Janeczek, K. Futera, Aneta Arazna |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Inkwell Nanotechnology 02 engineering and technology Substrate (printing) 021001 nanoscience & nanotechnology 01 natural sciences Industrial and Manufacturing Engineering Kapton Printed circuit board Electrical resistivity and conductivity 0103 physical sciences Electrical and Electronic Engineering Composite material 0210 nano-technology Electrical conductor FOIL method Electronic circuit |
| Zdroj: | Circuit World. 43:9-12 |
| ISSN: | 0305-6120 |
| Popis: | Purpose This paper aims to present the results of investigations of inkjet-printed electronic circuits fabricated on a flexible substrate (KAPTON foil) using silver nanoparticles ink. Design/methodology/approach Fully inkjet-printed conductive circuit tracks were printed on a flexible, transparent KAPTON foil, using a commercial 40LT-15 C nanosilver ink as well as a PixDro LP50 inkjet printer with KonicaMinnolta 512 printhead. After cure, electrical properties by resistance measurements and printing quality by optical and SEM microscopic observation of conductive tracks were examined. Afterwards, the tested samples were annealed for 1, 2 and 3 h at 150°C or subjected to cycling bending. Findings It was found that silver nanoparticles ink could be used for the preparation of electronic circuits using the inkjet printing technique. The obtained patterns had appropriate mapping and good quality. It was also noticed that thermal annealing caused a decrease in resistivity values of the tested lines irrespective of their width. Approximately 34 per cent decrease was achieved in the values of resistivity of all the tested lines after the first hour of thermal annealing. After the second hour, the values of resistivity decreased by another 50 per cent. There were no visible changes in resistivity values after 1,000 cycles of bending. Originality/value In this paper, the results of thermal annealing and bending tests of inkjet-printed silver nanoparticle conductive tracks on flexible substrate were presented. That is very important information for producing printed circuit boards using ecological, rapid and low-cost inkjet printing techniques, particularly during the production of printed circuit boards on flexible substrates working in different conditions of mechanical and thermal stresses. |
| Databáze: | OpenAIRE |
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