Thermal Stability and Reliability Analysis of Ultraviolet Light-emitting Diode Packages

Autor:	经 周 Jing Zhou, 刘 杰 Liu Jie, 樊嘉杰 Fan Jia-jie, 胡爱华 Hu Ai-hua, 孙 博 Sun Bo, 曹建武 Cao Jian-wu
Rok vydání:	2019
Předmět:	Radiation Reliability (semiconductor) Materials science business.industry Ultraviolet light Optoelectronics Thermal stability Condensed Matter Physics business Electronic Optical and Magnetic Materials Diode
Zdroj:	Chinese Journal of Luminescence. 40:871-878
ISSN:	1000-7032
DOI:	10.3788/fgxb20194007.0871
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::71cb637452a4e2d20d41142bfeab95eb https://doi.org/10.3788/fgxb20194007.0871 Zobrazit plný text záznamu