| Autor: |
Lee Chek Loon, Loh Wei Keat, Lee Chee Kan, Quah Chin Aik |
| Rok vydání: |
2010 |
| Předmět: |
|
| Zdroj: |
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT). |
| DOI: |
10.1109/iemt.2010.5746693 |
| Popis: |
PBGA (Plastic Ball Grid Array) has been around for years as the leading packaging technology for I/O controller. Occasionally PBGA package exhibits surface mount issues, typically the solder bridging, at very low defect per million. A series of investigation was carried out to address the key design modulators. This paper discussed the findings of how molding temperature could modulate the dynamic warpage characteristic of a PBGA package. Apart from design factors, the molding temperature plays significant role in reducing warpage at reflow temperature. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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