Test structure measuring inter- and intralayer coupling capacitance of interconnection with subfemtofarad resolution

Autor: Mitsutoshi Shirota, Yasuo Inoue, Tetsuya Watanabe, Shuhei Iwade, Toshiki Kanamoto, Tatsuya Kunikiyo, Yoshihide Ajioka, H. Asazato, H. Makino, K. Eikyu, K. Ishikawa
Rok vydání: 2004
Předmět:
Zdroj: IEEE Transactions on Electron Devices. 51:726-735
ISSN: 0018-9383
DOI: 10.1109/ted.2004.826899
Popis: We present a new test structure measuring inter- and intralayer coupling capacitance parasitic to the same target interconnection with subfemtofarad resolution. The coupling capacitance as well as fringing capacitance measured by the test structure are demonstrated for two-level copper interconnections used in 90-nm technology node. In addition, we demonstrate that the accuracy of layout parameters extraction is improved by nondestructive inverse modeling of a copper interconnect cross-sectional structure, which reproduces the pitch dependence of the measured inter- and intralayer coupling capacitance within about a 1% error.
Databáze: OpenAIRE