Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling

Autor:	Long Zhang, Dengjie Xiong, Zilong Su, Junfeng Li, Limeng Yin, Zongxiang Yao, Gang Wang, Liping Zhang, Hehe Zhang
Rok vydání:	2022
Předmět:	Mechanics of Materials Materials Chemistry General Materials Science
Zdroj:	Materials Today Communications. 33:104301
ISSN:	2352-4928
DOI:	10.1016/j.mtcomm.2022.104301
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7175376e24915475bba31943038c286e https://doi.org/10.1016/j.mtcomm.2022.104301 Zobrazit plný text záznamu Full Text from ScienceDirect