AirGaps for Ultra Low-k Interconnects Fabricated with Hardened Sacrificial Polymer

Autor:	Paul A. Kohl, Sue Ann Bidstrup Allen, Seongho Park, Jeff Krotine
Rok vydání:	2006
Předmět:	chemistry.chemical_classification Materials science chemistry Polymer Composite material
Zdroj:	ECS Transactions. 1:135-147
ISSN:	1938-6737 1938-5862
Popis:	Polymers based on norbornene have been used for low-k dielectric materials, advanced photoresists, and as sacrificial materials in the formation buried air-gaps. In this study, the hardness of thin films of butylpolynorbornene - triethoxysilylpolynorbornene copolymer was enhanced by exposure to electron beam radiation. The effect of electron energy, dose, and temperature on the thermal and mechanical properties of the irradiated copolymer films was investigated using dynamic thermal gravimetric analysis and nanoindentation. The hardness of the copolymer thin films was increased by electron beam irradiation; however, the thermal stability was degraded.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::71074c048a1162d4cd5512627fc7a286 https://doi.org/10.1149/1.2218485 Zobrazit plný text záznamu