Properties of basic dyes on polyacrylonitrile treated m-aramid fabrics
Autor: | Panya Srichandr, Somchai Udon, Kawee Srikulkit |
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Rok vydání: | 2013 |
Předmět: |
Materials science
Polymers and Plastics General Chemical Engineering technology industry and agriculture Polyacrylonitrile General Chemistry Color strength medicine.disease_cause Styrene Aramid chemistry.chemical_compound chemistry parasitic diseases medicine Dimethylformamide Dyeing Composite material Acrylic fiber |
Zdroj: | Fibers and Polymers. 14:736-742 |
ISSN: | 1875-0052 1229-9197 |
DOI: | 10.1007/s12221-013-0736-9 |
Popis: | Treatment of polyacrylonitrile (PAN) onto m-aramid fabric was carried out by pad-dry-cure method using dimethylformamide (DMF) dissolved acrylic fiber solution. The obtained PAN treated m-aramid fabric was dyed using exhaustion method with basic dyes. The effect of PAN treatment on fabric stiffness property was acceptable with acrylic fiber solutions ranging from 1 wt% to 4 wt%. Whilst, more than 4 wt% PAN treated fabrics exhibited undesirable stiffness. The dyeing results showed that PAN treated m-aramid fabrics exhibited a significant increase in color strength when compared to untreated fabric, arising from an increase in anionic dye sites (styrene SO3− group). Wash fastness was comparable to that of untreated fabric, indicating the strong interaction between dye molecules and the PAN. Rubbing fastness of treated fabrics was not affected by treatments with PAN concentrations lower than 4 wt%. Further increase in PAN concentration led to poorer rubbing fastness property due to the problem of surface dyeing. For light fastness, the PAN treatment failed to improve the light fastness property which is the main disadvantage of basic dyeing of aramid fabric. Finally, in case of PAN treatments with the range of 1 wt% to 4 wt%, the flame retardancy property of PAN treated m-aramid fabrics was found not affected by the percent add-on. However, above 4 wt% PAN treatment, the flame retardancy performance became deteriorated. |
Databáze: | OpenAIRE |
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