Modeling differential via holes
| Autor: | Eric Laermans, J. De Geest, Frank Olyslager, D. Morlion, D. De Zutter, S. Sercu |
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| Rok vydání: | 2001 |
| Předmět: |
Engineering
business.industry Numerical analysis Mathematical analysis Hardware_PERFORMANCEANDRELIABILITY Capacitance Inductance Printed circuit board Cascade Hardware_INTEGRATEDCIRCUITS Electronic engineering Waveform Electrical and Electronic Engineering Closed-form expression business Differential (mathematics) |
| Zdroj: | IEEE Transactions on Advanced Packaging. 24:357-363 |
| ISSN: | 1521-3323 |
| DOI: | 10.1109/6040.938303 |
| Popis: | In this paper, we present a method to characterize differential via holes in printed circuit boards in a both fast and accurate way. The via hole is modeled as a cascade of capacitances and inductances. We use FASTCAP to compute the values of the capacitances, and a closed form formula to obtain the inductance values. The numerical predictions are compared with experimental data. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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