SiP module warpage characterization and simulation study
| Autor: | Billy Ahn, Tetsuya Koyama, Takahiro Horie, Masahiro Tsuriya, Yonghyuk Jeong, Anthony D. Yang, Jeffrey E. Lee, Jim Hsu, Kiyoshi Oi |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
business.industry Manufacturing process Computer science 05 social sciences Mechanical engineering 3D modeling 01 natural sciences Characterization (materials science) Substrate (building) 0103 physical sciences Process integration 0501 psychology and cognitive sciences business 050104 developmental & child psychology |
| Zdroj: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). |
| DOI: | 10.23919/icep.2018.8374659 |
| Popis: | Warpage is one big challenge during manufacturing process for advanced packaging, which needs to be addressed for successful process integration. For these challenges, iNEMI has initiated System-in-Package module warpage project which is to understand the warpage behavior characteristics. This paper presents a comprehensive study on the performance of SiP module warpage with various components geometries with different components densities mounted on substrate, components gap and clearance, and various types of mold compound through experiments and statistical data analysis. In order to understand the behavior of warpage, the simulation tool which considers of the chemical shrinkage is verifying with the experimental data. From this study, we provide the basic design rules based on warpage experiment and simulation. |
| Databáze: | OpenAIRE |
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