Lead-Free Solders Property and Reliability of Electronics Packaging

Autor:	Hitoshi Honma, Tsuyoshi Yamamoto, Masayuki Kitajima, Masayuki Ochiai, Yoshihisa Kamiya, Osamu Higashi, Harumi Yagi
Rok vydání:	2002
Předmět:	Reliability (semiconductor) Materials science Electronic packaging General Medicine Lead (electronics) Automotive engineering
Zdroj:	Proceedings of the 1992 Annual Meeting of JSME/MMD. 2002:225-226
ISSN:	2433-1287
DOI:	10.1299/jsmezairiki.2002.0_225
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::70b2c016f7a34493220580f7e40f3ad7 https://doi.org/10.1299/jsmezairiki.2002.0_225 Zobrazit plný text záznamu