Eliminating the top causes of customer-attributable integrated circuit failures

Autor: Andrew H. Olney
Rok vydání: 2013
Předmět:
Zdroj: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Popis: The failure rates of electronic systems can be minimized if Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and Contract Manufacturers (CMs) follow specific guidelines for eliminating the most common causes of customer-attributable integrated circuit (IC) failures. Most importantly, OEMs/ODMs/CMs should always buy ICs directly from Original Component Manufacturers (OCMs) or their Authorized Distributors to ensure that ICs are authentic and have full factory warranties. Appropriate electrical overstress/electrostatic discharge (EOS/ESD) protection techniques should be used at the board-level and/or system-level. For particularly high-reliability applications, IC operating voltages and currents should be maintained well below IC Absolute Maximum Ratings. Since the failure rate for many IC failure mechanisms increases exponentially with increasing temperature, electronic systems should be designed to provide adequate cooling. Finally, OCMs' instructions for proper storage, handling, and board mounting of ICs need to always be followed, with particular attention given to moisture-sensitive components.
Databáze: OpenAIRE