Evaporation cooling of high power electronic devices

Autor:	A.V. Sharkov, G.N. Dulnev, V.A. Korablyev
Rok vydání:	1996
Předmět:	Materials science Critical heat flux business.industry Nuclear engineering General Engineering Semiconductor device Heat sink Coolant Boiling Power module Heat transfer Optoelectronics Electronics business
Zdroj:	IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 19:431-434
ISSN:	1070-9886
DOI:	10.1109/95.536845
Popis:	This paper presents the problems of choosing heat transfer devices with good heat dissipating ability under boiling, as well as their utilization for cooling power semiconductor devices, for example, diodes, transistors, and thyristors. The experimental investigation of heat transfer crisis in cooling channels under the forced movement of dielectric coolant was carried out.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::701e3ce08d6d341449b5d4bba1cdc050 https://doi.org/10.1109/95.536845 Zobrazit plný text záznamu