| Autor: |
Ron Huemoeller |
| Rok vydání: |
2012 |
| Předmět: |
|
| Zdroj: |
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000334-000346 |
| ISSN: |
2380-4491 |
| DOI: |
10.4071/2012dpc-ta11 |
| Popis: |
The market has narrowed its approach and solidified its direction for the majority of 2.5 and 3D TSV product technologies. Forecasts have now become real for these technologies and the end game realized as evidenced by production launch of the Xilinx Virtex-7. This talk will discuss market trends, anticipated product launch dates as well as general capacity needs as the market begins to rollout these new products. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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