P001 The Behavior of Thermal Fatigue Crack Growth in Solder Material due to Heat Flux Cycles

Autor:	Yuusuke Nakai, Yoshiya Ougi, Masayoshi Shimizu, Keiichi Nakase, Takahito Goshima
Rok vydání:	2007
Předmět:	Thermal fatigue Crack closure Materials science Solder material Heat flux Metallurgy Composite material
Zdroj:	The Proceedings of the Materials and Mechanics Conference. 2007:599-600
ISSN:	2424-2845
DOI:	10.1299/jsmemm.2007.599
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6fcbdff22d34ec5d0771d136dcf3096d https://doi.org/10.1299/jsmemm.2007.599 Zobrazit plný text záznamu