Special Topics in Surface Mount Soldering Problems and Other Soldering- Related Problems

Autor:	Jennie S. Hwang
Rok vydání:	1992
Předmět:	Engineering drawing Computer science Process (engineering) Soldering Solder paste Troubleshooting Solder ball Check List Construction engineering Mount Solder alloy
Zdroj:	Solder Paste in Electronics Packaging ISBN: 9780442013530
DOI:	10.1007/978-1-4615-3528-7_10
Popis:	The previous chapters have discussed the technology and scientific principles behind the major aspects of solder paste technology and applications. This chapter is to condense the common concerns and problems encountered by using solder paste one by one into a check list. It is hoped this chapter can be used as a troubleshooting guide with the objective that the users be able to establish a “trouble-free” process by intelligently learning from others’ experiences.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6fc89e6af369cac29c72efbfa21f4361 https://doi.org/10.1007/978-1-4615-3528-7_10 Zobrazit plný text záznamu