Electromigration Characterization for Multilevel Metallizations using Textured AlCu
Autor: | Larry M. Ting, Qi-Zhong Hong |
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Rok vydání: | 1996 |
Předmět: | |
Zdroj: | MRS Proceedings. 428 |
ISSN: | 1946-4274 0272-9172 |
Popis: | Electromigration lifetime dependence on crystallographic texture for AlCu interconnects is determined. It is found that enhancement of AlCu texture at orientation improves EM endurance. But this beneficial effect is limited after a certain level of texture enhancement is reached. The effect of lifetime improvement is proved to result from a decrease in atomic diffusivity. Saturation of the lifetime improvement effect for highly textured AlCu indicates a change in the main diffusion mechanism for electromigration, possibly from the regular grain boundary diffusion to diffusion through edge dislocations. |
Databáze: | OpenAIRE |
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