Electromigration Characterization for Multilevel Metallizations using Textured AlCu

Autor:	Larry M. Ting, Qi-Zhong Hong
Rok vydání:	1996
Předmět:	Materials science Grain boundary diffusion coefficient Texture (crystalline) Edge (geometry) Diffusion (business) Composite material Thermal diffusivity Saturation (magnetic) Electromigration Characterization (materials science)
Zdroj:	MRS Proceedings. 428
ISSN:	1946-4274 0272-9172
Popis:	Electromigration lifetime dependence on crystallographic texture for AlCu interconnects is determined. It is found that enhancement of AlCu texture at orientation improves EM endurance. But this beneficial effect is limited after a certain level of texture enhancement is reached. The effect of lifetime improvement is proved to result from a decrease in atomic diffusivity. Saturation of the lifetime improvement effect for highly textured AlCu indicates a change in the main diffusion mechanism for electromigration, possibly from the regular grain boundary diffusion to diffusion through edge dislocations.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6fb50b8ea8af9e3243ad5fe6ed3a7053 https://doi.org/10.1557/proc-428-75 Zobrazit plný text záznamu Full text from SpringerLink