New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers

Autor:	Nicolas Sousbie, Jacques Margail, H. Moriceau, Bernard Aspar, Chrystelle Lagahe-Blanchard
Rok vydání:	2006
Předmět:	Materials science business.industry Anodic bonding Wafer bonding Optoelectronics Wafer business Wafer backgrinding
Zdroj:	ECS Transactions. 3:79-90
ISSN:	1938-6737 1938-5862
Popis:	Direct wafer bonding is a generic technology enabling the fabrication of innovative structures. Adequate surface treatments allow bonding of virgin as well as partially or fully processed wafers, leading to new Anti-sticking BSOI, Patterned BSOI and Debondable BSOI with specific embedded functionalities. These engineered wafers answer to the evolution of requirements in microelectronics and microsystems.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6f979163e649545fd252e7d6baa325ae https://doi.org/10.1149/1.2357057 Zobrazit plný text záznamu