Electrodeposition of amorphous Au–Ni alloy film

Autor:	Kazutaka Senda, Masaru Kato, Junji Sasano, Tetsuya Osaka, Noriyuki Yamachika, Yutaka Okinaka, Yuta Musha
Rok vydání:	2008
Předmět:	Amorphous metal Materials science General Chemical Engineering Metallurgy Alloy chemistry.chemical_element Tungsten engineering.material Electrical contacts Amorphous solid Surface coating chemistry Plating Electrochemistry engineering Electroplating
Zdroj:	Electrochimica Acta. 53:4520-4527
ISSN:	0013-4686
DOI:	10.1016/j.electacta.2008.01.018
Popis:	It was found that, by choosing an optimum bath composition, amorphous Au–Ni alloy containing up to 40 at.% of Au with respect to the sum of Au and Ni can be electrodeposited from a bath prepared by excluding tungsten from the Au–Ni–W bath that we developed previously. Elemental analysis showed that the deposit contains 15–20 at.% of carbon and 2 at.% of nitrogen. Hardness of this deposit is almost three times as high as that of the conventional hard gold. The electrical contact resistance measured against a pure gold wire is comparable to that of the hard gold. The amorphous structure of the Au–Ni deposit is stable at temperatures up to 300 °C for at least 1 h. The amorphous tungsten-free Au–Ni deposit is worthy of consideration for applications in the fabrication of micro- and nano-scale electrical contacts.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6f6da24f0fa5f901808c5b3c7700caf5 https://doi.org/10.1016/j.electacta.2008.01.018 Zobrazit plný text záznamu Full Text from ScienceDirect