A Co-Design Approach to Understanding the Impact of Ultra-Wide-Bandgap Semiconductor Material Properties on Power Device Performance

Autor:	R. Kaplar, S. Goodnick, J. Shoemaker, R. Vatan, J. Flicker, A. Binder, S. Chowdhury
Rok vydání:	2022
Zdroj:	2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
DOI:	10.1109/edtm53872.2022.9798255
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6f405c37c15e9a245a627d4117344135 https://doi.org/10.1109/edtm53872.2022.9798255 Zobrazit plný text záznamu