| Autor: |
Kuo-Yu Lee, Jung-Tang Huang, Hou-Jun Hsu, Ting-Chiang Tsai |
| Rok vydání: |
2012 |
| Předmět: |
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| Zdroj: |
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact.2012.6420275 |
| Popis: |
In recent years, as mobile equipment such as cellular phones and PDAs become drastically higher performance and downsized, semiconductor devices are rapidly becoming more integrated and higher speed. As a result of high integration, the pitches of electrode pads in chips are becoming smaller than 100 µm. In some devices, pad pitches are as small as 40 µm. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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