Wideband Characterization of Materials in TSV Interposer Using Multi-objective Comprehensive Optimization
| Autor: | Yanling Wang, Penghui Pan, Yujun Yang, Daowei Wu, Yongsheng Guo |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). |
| DOI: | 10.1109/icept56209.2022.9872580 |
| Databáze: | OpenAIRE |
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