Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations: Invited Paper

Autor:	Michiel Vandemaele, Ben Kaczer, Erik Bury, Jacopo Franco, Adrian Chasin, Alexander Makarov, Hans Mertens, Geert Hellings, Guido Groeseneken
Rok vydání:	2023
Zdroj:	2023 IEEE International Reliability Physics Symposium (IRPS).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6e9e103b75b87d8398d643fd14ea1061 https://doi.org/10.1109/irps48203.2023.10118211 Zobrazit plný text záznamu