Multi-scale modeling of direct copper plating on resistive non-copper substrates

Autor:	Magi Margalit Nagar, Alan C. West, Philippe M. Vereecken, Johan Deconinck, Aleksandar Radisic, Liu Yang
Rok vydání:	2012
Předmět:	Coalescence (physics) Resistive touchscreen Materials science General Chemical Engineering Metallurgy Nucleation chemistry.chemical_element Conductivity Electrochemistry Copper chemistry Copper plating Wafer Composite material
Zdroj:	Electrochimica Acta. 78:524-531
ISSN:	0013-4686
DOI:	10.1016/j.electacta.2012.06.076
Popis:	The direct copper plating on resistive non-copper substrates is studied using a multi-scale modeling approach. A micro-scale nucleation model is coupled with the macro-scale current distribution model to predict the coalescence thickness and the thickness profile on a wafer. Simulation results show that the coalescence thickness may vary significantly with the distance from the wafer edge. The simulation tool is applied to the study of different factors involved in the plating process, including the propensity to nucleate on a given substrate, suppressor additives, substrate conductivity and the input current. The collective effects of these factors on nucleation and front propagation are investigated. High nucleation density and low coalescence thickness are demonstrated on a resistive substrate by introducing suppressor additives and ramping current in the plating.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6e8cafdfadcd3037aa537b1711d3efdb https://doi.org/10.1016/j.electacta.2012.06.076 Zobrazit plný text záznamu Full Text from ScienceDirect