| Autor: |
Charlie Koechlin, S. Gramens, R. Eberhardt, Erik Beckert, Marcel Hornaff, G. Fiault, P. Ribes, D. Burkhardt, Thomas Burkhardt, Andreas Kamm, Andreas Tünnermann |
| Rok vydání: |
2016 |
| Předmět: |
|
| Zdroj: |
Integrated Optics: Devices, Materials, and Technologies XX. |
| ISSN: |
0277-786X |
| DOI: |
10.1117/12.2208123 |
| Popis: |
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard taking as input specifications the requirements found for the optical beam expander for the European Space Agency (ESA) EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands; handling high mechanical and thermal loads without losing its optical performances. Finally a high-precision opto-mechanical lens mount has been assembled with a minimal localized stress ( |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
