Sputter deposition of copper oxide films
| Autor: | A. Dulmaa, Samira Khelifi, Diederik Depla, Henk Vrielinck |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Copper oxide
Cuprite Materials science Analytical chemistry General Physics and Astronomy chemistry.chemical_element 02 engineering and technology engineering.material 010402 general chemistry 01 natural sciences chemistry.chemical_compound Thin film Total pressure Surfaces and Interfaces General Chemistry Partial pressure Sputter deposition Paramelaconite 021001 nanoscience & nanotechnology Condensed Matter Physics Copper 0104 chemical sciences Surfaces Coatings and Films chemistry visual_art engineering visual_art.visual_art_medium 0210 nano-technology |
| Zdroj: | Applied Surface Science. 492:711-717 |
| ISSN: | 0169-4332 |
| DOI: | 10.1016/j.apsusc.2019.06.263 |
| Popis: | Copper oxide thin films are grown by reactive magnetron sputter deposition. To define the parameter space to obtain CuO films, the influence of the oxygen partial pressure, the total pressure, and the discharge current was investigated on the phase formation. A clear change from pure copper, over cuprite (Cu 2 O), and paramelaconite (Cu 4 O 3 ) to tenorite (CuO) thin films with increasing oxygen partial pressure was observed using X-ray diffraction and Fourier transform infrared spectroscopy. The main driving force defining the phase composition is the oxygen partial pressure, while the influence of the total pressure, and the discharge current is minimal. A clear condition to obtain phase pure CuO films could be defined based on the measured discharge voltage. Both the domain size, and the Bragg peak position for pure CuO thin films can be correlated to the negative ion bombardment during film growth. |
| Databáze: | OpenAIRE |
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