Investigation of the Shear Stresses Experienced during Melting Using Novel Microencapsulated Dye Sensors
| Autor: | W. E. Baker, D. C. Clark, K. Geramita |
|---|---|
| Rok vydání: | 1999 |
| Předmět: |
chemistry.chemical_classification
Extrusion moulding Materials science Polymers and Plastics Mechanical Engineering Plastics extrusion 02 engineering and technology Polymer 021001 nanoscience & nanotechnology Shear rate 020303 mechanical engineering & transports 0203 mechanical engineering Shear (geology) chemistry Mechanics of Materials Materials Chemistry Ceramics and Composites Shear stress Extrusion Polymer blend Composite material 0210 nano-technology |
| Zdroj: | Journal of Reinforced Plastics and Composites. 18:271-278 |
| ISSN: | 1530-7964 0731-6844 |
| DOI: | 10.1177/073168449901800307 |
| Popis: | A novel technique employing shear stress sensitive microcapsules (MC) was utilized to investigate the shear stresses that were experienced by a single polymer and the components of a polymer blend during melting, in both a lab scale single screw extruder (SSE) and internal batch mixer. It was found that the MC could sense differing melting environments when process variables such as temperature and shear rate, as well as blend constituents were manipulated. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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