High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System

Autor: Bruce W. Lee, Fang Li, Sally Ann Henry, She Na Jia, Fu Ping Chen, Tao Zhang, Hong Li, Chung Wei Wang, David H. Wang, Yi Yang, Wen Jun Wang, Jun Huang, Hai Bo Lei, Zhang Xiao-Yan, Jane Wang, Yunho Kim, Jason Lee, Zhang Yu Yu
Rok vydání: 2021
Předmět:
Zdroj: Solid State Phenomena. 314:133-139
ISSN: 1662-9779
Popis: Batch SPM systems do not meet the current clean specification/requirements below 28nm. Single wafer SPM systems use a high volume of chemistry which runs to drain, while meeting the cleaning specifications below 28nm. The work in this paper describe the use of a batch SPM system and a single wafer clean in an integrated system, Ultra-C Tahoe which results in meeting the technical specification and using less that 80% of the SPM chemistry used in single wafer systems. The data collected shows this new system meet the specifications, whilst saving more than 80%of SPM chemistry.
Databáze: OpenAIRE