A novel approach to resistivity and interconnect modeling
| Autor: | L. Carbonell, Francesca Iacopi, Youssef Travaly, M. Bamal, M. Van Hove, Michele Stucchi, G. Beyer |
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| Rok vydání: | 2006 |
| Předmět: |
Physics
Linear representation Interconnection Scattering chemistry.chemical_element Integrated circuit RC time constant Condensed Matter Physics Topology Copper Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention chemistry law Electrical resistivity and conductivity Simple (abstract algebra) Electrical and Electronic Engineering |
| Zdroj: | Microelectronic Engineering. 83:2417-2421 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2006.10.048 |
| Popis: | This paper describes a simple and novel approach to calculate the line resistance of copper interconnects. The proposed methodology is simply based on a linear representation of the Cu resistivity vs. 1/S"C"u (S"C"u is the Cu cross-sectional area) in which the slope captures the net result of scattering phenomena in Cu. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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