YFET - Trench superjunction process window extended

Autor: Franz Hirler, Holger Kapels
Rok vydání: 2009
Předmět:
Zdroj: 2009 21st International Symposium on Power Semiconductor Devices & IC's.
ISSN: 1943-653X
DOI: 10.1109/ispsd.2009.5158061
Popis: The drift zone of superjunction devices consists of compensated n- and p-columns. The manufacturability of such devices is based on the thorough control of acceptors and donator concentrations. Shrinking the cell pitch to a few micrometers requires considerably better compensation control compared to 10µm pitch devices. A new concept that applies a stack of Y-shaped field plates to a charge compensated device is investigated by numerical simulation. The YFET concept provides a 7 times larger compensation process window compared to a device with oxide filled trenches, allowing much higher doping concentrations. A specific on-resistance of 0.65Ωmm2 at a breakdown voltage of 680V can be achieved at a cell pitch of about 4.6µm.
Databáze: OpenAIRE