Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles
| Autor: | Kyu-Han Lee, Do Trong Thanh, Noh-Joon Park, Min Han, Kwanseon Ju, Jae Hyung Ryu, Kang Bok Ko, Nam Han, Chang-Hee Hong, Kyurin Kim, Yongsu Lim, Chang Hee Jo, Tran Viet Cuong, Beo Deul Ryu |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
Graphene Mechanical Engineering Thermal resistance Composite number Oxide Nanoparticle chemistry.chemical_element 02 engineering and technology Heat sink 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Copper 0104 chemical sciences law.invention chemistry.chemical_compound Chemical engineering chemistry Mechanics of Materials law Heat transfer General Materials Science 0210 nano-technology |
| Zdroj: | Materials Research Bulletin. 110:76-81 |
| ISSN: | 0025-5408 |
| Popis: | Three–dimensional thermal interface materials made of graphene oxide (GO) and copper nanoparticles (Cu NPs) were applied for enhancing light–emitting diode heat dissipation. The effect of the stacking order of GO and Cu NPs on thermal resistance was explored by creating two types of samples: spray–coated with a mixed GO–Cu NPs and layer–by–layer stacked with GO/Cu NPs/GO. A reduction of thermal resistance for mixed GO–Cu NPs and layer–by–layer stacked structure by 37% and 33%, respectively, compared to that of Al heat sink. The lower thermal resistance of the mixed GO–Cu NPs sample is attributed to the fact that distributed Cu NPs at the step edge of GO sheets enhances the out–of–plane heat transfer at wrinkles/folds of GO interlayers. Therefore, a mixed GO–Cu NPs is considered as a promising composite for effective thermal management of high–performance optoelectronic devices. |
| Databáze: | OpenAIRE |
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