Thermal Shock Resistances of a Bonding Material of C/C Composite and Copper

Autor:	Nobuaki Noda, Kiyohiro Kawamata, Osamu Motojima, Tatsuo Oku, Akira Kurumada, Brian McEnaney
Rok vydání:	1997
Předmět:	Thermal shock Materials science Scanning electron microscope Mechanical Engineering Delamination Composite number chemistry.chemical_element Microstructure Copper Fracture toughness chemistry Mechanics of Materials Fracture (geology) General Materials Science Composite material
Zdroj:	TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 63:794-800
ISSN:	1884-8338 0387-5008
DOI:	10.1299/kikaia.63.794
Popis:	The purpose of this study is to contribute to the development and the safety design of plasma facing components for fusion reactor devices. We evaluated the thermal shock resistance and the thermal shock fracture toughness of a bonding material which was jointed a carbon-fiber-reinforced carbon composite (C/C composite) to oxygen-free copper. We also examined the microstructures of the bonding layers using a scanning electron microscope before and after thermal shock tests. The bonding material did not fracture during thermal shock tests. However, thermal cracks and delamination cracks were observed in the bonding layers.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::6d01602221f4b66c9df8f65c0d6f29ac https://doi.org/10.1299/kikaia.63.794 Zobrazit plný text záznamu